This project focuses on the thermal management of electronic modules, drawing on four years of specialization in thermodynamics. The work involves a comprehensive approach to thermal analysis, combining hand calculations with simulations to explore the limits achievable under various cooling methods and space constraints. The focus is on optimizing the performance of electronic components through both passive and active cooling techniques.
The project applies both internal and external convection methods for passive cooling. Detailed simulations are conducted to understand the cooling effects under different conditions, which are then validated through real-world testing.
Simulation of a case using passive cooling
Real test to compare the simulation
For high-performance components such as CPUs and FPGAs, the project utilizes forced air cooling. This involves the use of fans and heatsinks to maintain component temperatures within safe operational limits, even under high loads.
Example of a heatsink with a fan
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The Battery Cell Emulator Sub-Rack was developed to meet the growing market demand for an advanced battery emulation system. This emulator can accurately simulate both charging and discharging cycles, making it a crucial tool for testing battery performance and reliability. The project began with the conceptualization of the sub-rack's size, designed to accommodate the maximal power consumption of the entire unit. Collaboration with PCB developers was essential in creating a modular case that could also house additional units like a Fault Insertion Unit and a Temperature Emulator. The design had to account for several critical factors. During the charging phase, the module needed to support high current on the power supply side and high voltage on the output side, requiring appropriate insulation and adherence to safety norms. For discharging simulations, the system needed to manage significant power dissipation, necessitating an efficient cooling system. The case and fans were meticulously designed to ensure optimal heat dissipation and maintain system stability.
Caption: Battery Cell Emulator Front View
Caption: Battery Cell Emulator Side View
Caption: Fault Insertion Unit
Caption: Temperature Sensor Emulator
In the development of a new desktop computer, it was essential to have a stable bezel for each module created from an aluminum profile. However, the challenge was that each module had unique cutouts. The solution was to automate a Datron Neo CNC milling machine to efficiently mill the necessary cutouts.
Caption: fixture which can hold up to 40 profiles
I designed a fixture for the CNC that could accommodate up to 40 profiles simultaneously. Subsequently, using the Datron Next program, I created a user-friendly interface for production.
Caption: one from the unlimited version of a final module milled
This innovative solution enabled every production team member, even those without extensive mechanical backgrounds or prior training, to easily operate the CNC and manufacture the required profiles for the modules.
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When I joined Speedgoat GmbH, I encountered the task of finalizing the design and establishing the assembly process for prototypes of a new desktop computer, the Performance P3.
This endeavor proved more time-consuming than initially anticipated due to redesign issues. We had to address multiple tolerance problems and account for numerous configurations.
After two years, we were prepared for serial production. I meticulously organized all the ordering lists and configured the production process to create a streamlined assembly line.
Given the myriad configuration options, I also devised dynamic assembly instructions. These instructions allowed production personnel to simply scan the order paper and access the appropriate assembly guidance.
Caption: Standard Option for Desktop
Caption: Standard Option for Rack mount
Caption: Option with the connectors on the rear side
Caption: Option with more connectors
This project focuses on the thermal management of electronic modules, drawing on four years of specialization in thermodynamics. The work involves a comprehensive approach to thermal analysis, combining hand calculations with simulations to explore the limits achievable under various cooling methods and space constraints. The focus is on optimizing the performance of electronic components through both passive and active cooling techniques.
The project applies both internal and external convection methods for passive cooling. Detailed simulations are conducted to understand the cooling effects under different conditions, which are then validated through real-world testing.
Simulation of a case using passive cooling
Real test to compare the simulation
For high-performance components such as CPUs and FPGAs, the project utilizes forced air cooling. This involves the use of fans and heatsinks to maintain component temperatures within safe operational limits, even under high loads.
Example of a heatsink with a fan